Patent Assignment
Reel/Frame 024011/0861
Change of Name
Recorded: 2010-03-02
Pages: 3
Assignor
ADVANCED INTERCONNECT TECHNOLOGIES LIMITED
Executed: 2007-08-06
Assignee
UNISEM (MAURITIUS) HOLDINGS LIMITED
608 ST. JAMES COURT, ST. DENIS STREET, PORT LOUIS, MAURITIUS
Covered Properties
(3)
Reversible Leadless Package and Methods of Making and Using Same
Method of Making Flip-Chip Package with Underfill
Patent:
7,700,414 →
Application:
11/709,403 →
Method of Making Thermally Enhanced Substrate-Base Package
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 20, 2006
From: ISLAM, SHAFIDUL; SAN ANTONIO, ROMARICO S.
To: ADVANCED INTERCONNECT TECHNOLOGIES LIMITED
Reel/Frame 017818/0205 →
Assignment of Assignor's Interest
May 30, 2007
From: LEUNG, TIMOTHY; RAMOS, MARY JEAN BAJACAN; YEOW, GAN KIAN; LWIN, KYAW KO
To: ADVANCED INTERCONNECT TECHNOLOGIES LIMITED
Reel/Frame 019426/0679 →
Assignment of Assignor's Interest
Jul 19, 2019
From: UNISEM (MAURITIUS) HOLDINGS LIMITED
To: UNISEM (M) BERHAD
Reel/Frame 049808/0098 →