Patent Assignment
Reel/Frame 024019/0851
Assignment of Assignor's Interest
Recorded: 2010-03-03
Pages: 2
Assignors
CHEN, NENG-KUO
Executed: 2010-02-24
TZENG, KUO-HWA
Executed: 2010-02-22
TSAI, CHENG-YUAN
Executed: 2010-02-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Forming Shallow Trench Isolation Structure