Patent Assignment
Reel/Frame 024054/0917
Assignment of Assignor's Interest
Recorded: 2010-03-10
Pages: 2
Assignors
HABU, TAKASHI
Executed: 2010-03-03
ASAI, FUMITERU
Executed: 2010-03-03
TAKAHASHI, TOMOKAZU
Executed: 2010-03-03
NISHIO, AKINORI
Executed: 2010-03-03
SHINTANI, TOSHIO
Executed: 2010-03-03
Assignee
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, JAPAN
Covered Property
(1)
Substrate-Less Pressure-Sensitive Adhesive Sheet for Protection of Semiconductor Wafer, Method for Grinding Back Side of Semiconductor Wafer Using Pressure-Sensitive Adhesive Sheet, and Method for Producing Pressure-Sensitive Adhesive Sheet