Patent Assignment
Reel/Frame 024059/0191
Assignment of Assignor's Interest
Recorded: 2010-03-10
Pages: 3
Assignor
DINEGA, DMITRY P.
Executed: 2008-11-14
Assignee
DOW GLOBAL TECHNOLOGIES INC.
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property
(1)
Process for Bonding Reactive Adhesives to Substrates
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 10, 2010
From: TRIBELHORN, ULRICH; HERGER HASSAN, RENATE R.
To: DOW EUROPE GMBH
Reel/Frame 024059/0250 →
Assignment of Assignor's Interest
Mar 10, 2010
From: THE DOW CHEMICAL COMPANY
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 024059/0291 →
Assignment of Assignor's Interest
Mar 10, 2010
From: DOW EUROPE GMBH
To: THE DOW CHEMICAL COMPANY
Reel/Frame 024059/0280 →
Change of Name
Mar 21, 2011
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 025992/0443 →
Assignment of Assignor's Interest
Sep 10, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 069923/0030 →
Assignment of Assignor's Interest
Sep 10, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068922/0001 →
Change of Legal Entity
Sep 10, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068907/0881 →