IP Library Granted Patent US 8,388,797
Granted Patent B2
US 8,388,797 · App. 12/549,553 · Granted Mar 5, 2013

Process for bonding reactive adhesives to substrates

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Quick Facts
Patent No.
US 8,388,797
App. No.
12/549,553
Granted
Mar 5, 2013
Kind
B2
Abstract

The invention is a system, or kit, comprising i) a stable solution or dispersion of a catalyst for the curing of a reactive adhesive system; and in a separate part ii) an uncured reactive adhesive system wherein the catalyst of part i) accelerates the cure of the reactive adhesive system. The reactive adhesive system can be a one or two-part system. In another embodiment, the invention is a method of bonding a reactive adhesive to a substrate comprising: a) contacting a catalyst for the curing of the reactive adhesive in a volatile solvent with the surface of the substrate to which the adhesive will be bonded; b) allowing the volatile solvent to volatilize away; c) contacting a reactive adhesive with the surface treated in step a) and d) allowing the adhesive to cure. This process is performed in the absence of a primer and a film forming agent.

Claims (37)

1. A method of bonding a reactive adhesive to at least one substrate comprising:

a) contacting a tertiary amine catalyst for a curing of a polyisocyanate based adhesive system in a volatile hydrocarbon solvent or dispersant with the surface of the substrate comprising a coated metal to which the polyisocyanate based adhesive system will be bonded;

b) allowing the volatile hydrocarbon solvent or dispersant to volatilize away;

c) contacting a reactive polyisocyanate based adhesive system with the surface treated in step a); and

d) allowing the polyisocyanate based adhesive system to cure.

2. A method according to claim 1 wherein the first substrate is bonded to a second substrate with the adhesive disposed between the two substrates before the reactive adhesive is cured.

3. A method according to claim 1 wherein the second substrate is treated with the catalyst in a volatile solvent or dispersant on the portion of the surface to be contacted with the reactive adhesive.

4. A method according to claim 1 wherein the adhesive is a one-part or two-part polyisocyanate based adhesive system.

5. A method according to claim 1 , wherein the volatile solvent is one or more of an aliphatic hydrocarbon, cycloaliphatic hydrocarbon, or aromatic hydrocarbon.

6. A method according to claim 5 wherein the concentration of catalyst in volatile solvent or dispersant is from about 0.01 to about 20 percent by weight.

7. A method according to claim 1 wherein after step b) only catalyst is located on the surface of the substrate to which the adhesive is to be bonded.

8. A method according to claim 1 wherein the catalyst solution further comprises a marker.

9. A method according to claim 8 wherein after step b) only catalyst and marker are located on the surface of the substrate to which the adhesive is to be bonded.

10. A method according to claim 1 wherein the catalyst solution does not contain a film forming resin.

11. A method according to claim 1 wherein the substrate comprises e-coated metal.

12. A method according to claim 11 wherein the e-coated metal is aluminum or steel.

13. A method according, to claim 1 wherein the reactive adhesive on the substrate is heated.

14. A method according to claim 13 wherein the reactive adhesive on the substrate is heated from 60° C. to 180° C.

15. A method of bonding a reactive adhesive to at least one substrate comprising:

a) contacting a catalyst comprising tris-(dimethylaminomethyl) in a volatile hydrocarbon solvent or dispersant with the surface of the substrate to which the polyisocyanate adhesive system will be bonded;

b) allowing the volatile solvent or dispersant to volatilize away;

c) contacting it reactive polyisocyanate adhesive system with the surface treated in step a); and

d) allowing the polyisocyanate adhesive system to cure.

16. A method according to claim 15 wherein the first substrate is bonded to a second substrate with the adhesive disposed between the two substrates before the reactive adhesive is cured.

17. A method according to claim 15 wherein the second substrate is treated with the catalyst in a volatile solvent or dispersant on the portion of the surface to be contacted with the reactive adhesive.

18. A method according to claim 15 wherein the adhesive is a one-part or two-part polyisocyanate based adhesive system.

19. A method according to claim 15 wherein the volatile solvent is one or more of an aliphatic hydrocarbon, cycloaliphatic hydrocarbon, or aromatic hydrocarbon.

20. A method according to claim 19 wherein the concentration of catalyst in volatile solvent or dispersant is from about 0.01 to about 20 percent by weight.

21. A method according to claim 15 wherein after step b) only catalyst is located on the surface of the substrate to which the adhesive is to be bonded.

22. A method according to claim 15 wherein the catalyst solution further comprises a marker.

23. A method according to claim 22 wherein after step b) only catalyst and marker are located on the surface of the substrate to which the adhesive is to be bonded.

24. A method according to claim 15 wherein the catalyst solution does not contain as film forming resin.

25. A method according to claim 15 wherein the substrate comprises coated metal.

26. A method according to claim 25 wherein the substrate comprises e-coated metal.

27. A method according to claim 26 wherein the e-coated metal is aluminum or steel.

28. A method according to claim 15 wherein the reactive adhesive on the substrate is heated.

29. A method according to claim 28 wherein the reactive adhesive on the substrate is heated from 60° C. to 180° C.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 069923/0030 →
CHANGE OF LEGAL ENTITY Recorded Sep 10, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068907/0881 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068922/0001 →
CHANGE OF NAME Recorded Mar 21, 2011
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 025992/0443 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2010
From: DINEGA, DMITRY P.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 024059/0191 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2010
From: TRIBELHORN, ULRICH; HERGER HASSAN, RENATE R.
To: DOW EUROPE GMBH
Reel/Frame 024059/0250 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2010
From: DOW EUROPE GMBH
To: THE DOW CHEMICAL COMPANY
Reel/Frame 024059/0280 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2010
From: THE DOW CHEMICAL COMPANY
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 024059/0291 →