Patent Assignment
Reel/Frame 024072/0950
Assignment of Assignor's Interest
Recorded: 2010-03-12
Pages: 3
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property
(1)
Semiconductor Device with High Density Optical Chips and Manufacturing Method Thereof