Patent Assignment
Reel/Frame 024077/0087
Assignment of Assignor's Interest
Recorded: 2010-03-15
Pages: 2
Assignors
CHANG, HUI-LIN
Executed: 2009-05-20
LIN, CHIH-LUNG
Executed: 2009-05-20
JANG, SYUN-MING
Executed: 2009-05-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Composite Underfill and Semiconductor Package
Application:
12/714,209 →
Publication:
US 2010/0295173