Patent Assignment
Reel/Frame 024098/0802
Assignment of Assignor's Interest
Recorded: 2010-03-18
Pages: 2
Assignor
NARITA, TAKENORI
Executed: 2009-12-22
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, JAPAN
Covered Property
(1)
Cmp Slurry for Silicon Film Polishing and Polishing Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Notice of Change of Address of Assignee
Apr 9, 2014
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 032642/0854 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →