Patent Assignment
Reel/Frame 024107/0019
Assignment of Assignor's Interest
Recorded: 2010-03-19
Pages: 3
Assignor
YANG, KUO-PIN
Executed: 2010-03-05
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Chip Having a Bump and Package Having the Same