Patent Assignment
Reel/Frame 024119/0813
Assignment of Assignor's Interest
Recorded: 2010-02-12
Pages: 7
Assignors
CHOI, SUK-HUN
Executed: 2010-01-21
HONG, CHANG-KI
Executed: 2010-02-02
CHOI, JAE-HYOUNG
Executed: 2010-01-20
SON, YOON-HO
Executed: 2010-01-20
PARK, MIN-YOUNG
Executed: 2010-01-20
TAK, YONG-SUK
Executed: 2010-01-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Semiconductor Devices and Semiconductor Devices Including a Contact Plug Processed by Rapid Thermal Annealing