IP Library › Assignment 024129/0405
Patent Assignment
Reel/Frame 024129/0405

Assignment of Assignor's Interest

Recorded: 2010-03-24 Pages: 2
Assignor
WEI, HSIU-PING
Executed: 2010-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Bump Pad Structure
Patent: 8,405,211 →
Application: 12/726,449 →
Publication: US 2010/0283148
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Inventors to the Previously Recorded Assignment Inadvertently Left Off Previously Recorded on Reel 024129 Frame 0405. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest (See Document for Details). Mar 25, 2010
From: TSAI, HAO-YI; CHEN, HSIEN-WEI; LIU, YU-WEN; CHEN, YING-JU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 024138/0024 →