IP Library › Assignment 024138/0024
Patent Assignment
Reel/Frame 024138/0024

Corrective Assignment to Correct the Inventors to the Previously Recorded Assignment Inadvertently Left Off Previously Recorded on Reel 024129 Frame 0405. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest (See Document for Details).

Recorded: 2010-03-25 Pages: 6
Assignors
TSAI, HAO-YI
Executed: 2010-03-10
CHEN, HSIEN-WEI
Executed: 2010-03-10
LIU, YU-WEN
Executed: 2010-03-10
CHEN, YING-JU
Executed: 2010-03-10
WEI, HSIU-PING
Executed: 2010-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Bump Pad Structure
Patent: 8,405,211 →
Application: 12/726,449 →
Publication: US 2010/0283148
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 24, 2010
From: WEI, HSIU-PING
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 024129/0405 →