Patent Assignment
Reel/Frame 024144/0617
Assignment of Assignor's Interest
Recorded: 2010-03-26
Pages: 2
Assignor
TELEDYNE TECHNOLOGIES INCORPORATED
Executed: 2007-02-05
Assignee
TELEDYNE TECHNOLOGIES INCORPORATED
1049 CAMINO DOS RIOS, THOUSAND OAKS, CALIFORNIA, 91360
Covered Property
(1)
Destructor Integrated Circuit Chip, Interposer Electronic Device and Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 25, 2005
From: PHAM, CUONG V.; CHUBIN, DAVID E.; KUAN, AARON D.; KHALIFA, COLLEEN L.
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 016228/0085 →
Assignment of Assignor's Interest
Jul 13, 2023
From: TELEDYNE TECHNOLOGIES INCORPORATED
To: TELEDYNE BROWN ENGINEERING, INC.
Reel/Frame 064245/0025 →