Patent Assignment
Reel/Frame 064245/0025
Assignment of Assignor's Interest
Recorded: 2023-07-13
Pages: 6
Assignor
TELEDYNE TECHNOLOGIES INCORPORATED
Executed: 2023-07-03
Assignee
TELEDYNE BROWN ENGINEERING, INC.
1049 CAMINO DOS RIOS, THOUSAND OAKS, CALIFORNIA, 91360
Covered Properties
(10)
Passive Magnetic Latch
Destructor Integrated Circuit Chip, Interposer Electronic Device and Methods
Methods for Forming an Anti-Tamper Pattern
Patent:
7,640,658 →
Application:
11/252,402 →
Destructor Integrated Circuit Chip, Interposer Electronic Device and Methods
Patent:
7,489,013 →
Application:
11/252,403 →
Anti-Tamper Mesh
Patent:
7,947,911 →
Application:
11/944,771 →
Destructor Integrated Circuit Chip, Interposer Electronic Device and Methods
Patent:
7,880,248 →
Application:
12/368,256 →
Chip Scale Fiber Optic Transmitter, Receiver, Transceiver
Patent:
8,787,766 →
Application:
12/641,070 →
Method for Forming an Anti-Tamper Mesh
Patent:
8,240,038 →
Application:
12/653,919 →
Destructor Integrated Circuit Chip, Interposer Electronic Device and Methods
Patent:
8,268,668 →
Application:
12/798,733 →
Anti-Tamper Mesh
Patent:
8,399,781 →
Application:
13/045,348 →
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 1, 2004
From: GRIGOROV, ILYA L.
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 016053/0862 →
Assignment of Assignor's Interest
Jan 25, 2005
From: PHAM, CUONG V.; CHUBIN, DAVID E.; KUAN, AARON D.; KHALIFA, COLLEEN L.
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 016228/0085 →
Assignment of Assignor's Interest
Dec 23, 2005
From: CHUBIN, DAVID E.; PHAM, CUONG V.; KHALIFA, COLLEEN L.; BULLER, RANDALL DAVID
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 016938/0437 →
Assignment of Assignor's Interest
Jan 10, 2006
From: PHAM, CUONG V.; CHUBIN, DAVID E.; CLARKE, ROBERT A.; KUAN, AARON D.
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 016992/0145 →
Assignment of Assignor's Interest
Nov 26, 2007
From: PHAM, CUONG V.; CHUBIN, DAVID E.; CLARKE, ROBERT A.; KUAN, AARON D.
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 020152/0681 →
Assignment of Assignor's Interest
Jul 17, 2009
From: PHAM, CUONG V.; CHUBIN, DAVID E.; KHALIFA, COLLEEN L.
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 022970/0929 →
Assignment of Assignor's Interest
Dec 23, 2009
From: SHU, GOLDEN G., DR.; HAYS, RONALD
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 023693/0631 →
Assignment of Assignor's Interest
Mar 26, 2010
From: TELEDYNE TECHNOLOGIES INCORPORATED
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 024144/0617 →
Assignment of Assignor's Interest
Jun 14, 2010
From: PHAM, CUONG V.; CHUBIN, DAVID E.; KUAN, AARON D.; KHALIFA, COLLEEN L.
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 024528/0482 →
Assignment of Assignor's Interest
Mar 11, 2011
From: PHAM, CUONG V.; CHUBIN, DAVID E.; CLARKE, ROBERT A.; KUAN, AARON D.
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 025937/0250 →
Assignment of Assignor's Interest
Mar 11, 2011
From: PHAM, CUONG V.; CHUBIN, DAVID E.; CLARKE, ROBERT A.; KUAN, AARON D.
To: TELEDYNE TECHNOLOGIES INCORPORATED
Reel/Frame 025937/0585 →