Methods for forming an anti-tamper pattern
A method of forming an anti-tamper mesh on an electronic device. The method includes forming at least one terminal on the electronic device and forming a conductive mesh on at least one surface of the electronic device, wherein the conductive mesh is in electrical contact with the terminal, and wherein the terminal facilitates electrical conduction between the conductive mesh and an electrical detection circuit.
1. A method of forming a conductive pattern on an electronic device, the conductive pattern to detect tampering of the electronic device, the method comprising:
forming at least one terminal on the electronic device, the electronic device comprising at least one of a semiconductor device, an integrated circuit chip, and an electronic substrate; forming a non-conductive layer on the electronic device; positioning the electronic device proximate a second device, the second device for forming the conductive pattern; and
moving at least one of the electronic device and the second device to form the conductive pattern on at least two surfaces of the electronic device with the second device, wherein the conductive pattern is formed on the non-conductive layer and comprises a plurality of conductive traces, and wherein each one of the plurality of conductive traces is formed on each one of the at least two surfaces of the electronic device and is continuous therebetween; wherein the conductive pattern is electrically connected to the at least one terminal, and wherein the at least one terminal facilitates electrical conduction between the conductive pattern and an electrical detection circuit of the electronic device.
2. The method of claim 1 , further comprising:
depositing a non-conductive layer between a plurality of adjacent layers of deposited conductive patterns.
3. The method of claim 1 , comprising curing the plurality of conductive traces with one of an infrared light source, a visible light source, and an ultraviolet light source.
4. The method of claim 1 , comprising thermally curing the plurality of conductive traces.
5. The method of claim 1 , wherein moving at least one of the electronic device and second device includes rotating the electronic device relative to the second device.
6. The method of claim 1 , wherein moving at least one of the electronic device and second device includes rotating the second device relative to the electronic device.
7. The method of claim 1 , wherein the second device comprises an inkjet printer.
8. The method of claim 1 , wherein the second device comprises a device for applying an evaporated coating of a metal.
9. The method of claim 1 , wherein the second device comprises a sputtering device.
10. The method of claim 1 , wherein the second device comprises a screen printing device.
11. The method of claim 1 , wherein the second device comprises a syringe dispensing device.