Patent Assignment
Reel/Frame 024160/0452
Assignment of Assignor's Interest
Recorded: 2010-03-30
Pages: 2
Assignor
HITACHI, LTD.
Executed: 2010-03-29
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(6)
Leadframe, Semiconductor Integrated Circuit Device Using the Same, and Method of and Process for Fabricating the Same
Patent:
5,378,656 →
Application:
08/038,684 →
Leadframe Semiconductor Integrated Circuit Device Using the Same and Method of and Process for Fabricating the Two
Patent:
5,637,913 →
Application:
08/311,021 →
Nonvolatile Semiconductor Memory Device and Data Writing Method Therefor
Patent:
5,959,882 →
Application:
08/890,396 →
Nonvolatile Semiconductor Memory Device Including Correction of Erratic Memory Cell Data
Nonvolatile semiconductor memory device and data writing method therefor
Patent:
6,320,785 →
Application:
09/679,867 →
Semiconductor Device and a Method of Manufacturing the Same and Designing the Same
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 21, 1994
From: KAJIHARA, YUJIRO; SUZUKI, KAZUNARI; TSUBOSAKI, KUNIHIRO; SUZUKI, HIROMICHI
To: HITACHI, LTD.; HITACHI MICROCOMPUTER SYSTEM LTD.
Reel/Frame 007070/0577 →
Assignment of Assignor's Interest
Jul 9, 1997
From: YOSHIDA, KEIICHI; KUBONO, SHOOJI
To: HITACHI, LTD; HITACHI ULSI ENGINEERING CORP.; HITACHI ULSI ENGINEERING CORP.
Reel/Frame 008706/0129 →
Change of Name
May 18, 2000
From: HITACHI MICROCOMPUTER SYSTEM, LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 010828/0905 →
Change of Name
May 26, 2000
From: HITACHI MICROCOMPUTER SYSTEM, LTD.
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 010804/0789 →
Merger
Mar 24, 2010
From: HITACHI ULSI ENGINEERING CORPORATION
To: HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 024128/0559 →
Merger
Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Assignment of Assignor's Interest
May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →
Patent Security Agreement
Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents
Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement.
Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment.
Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →