Patent Assignment
Reel/Frame 024192/0781
Assignment of Assignor's Interest
Recorded: 2010-04-06
Pages: 3
Assignors
BABA, SUSUMU
Executed: 2010-03-19
MASUDA, MASACHIKA
Executed: 2010-03-19
SUZUKI, HIROMICHI
Executed: 2010-03-19
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1, ICHIGAYA-KAGA-CHO 1-CHOME, SHINJUKU-KU, TOKYO-TO, JAPAN
Covered Property
(1)
Semiconductor Wiring Assembly, Semiconductor Composite Wiring Assembly, and Resin-Sealed Semiconductor Device