Patent Assignment
Reel/Frame 024197/0305
Assignment of Assignor's Interest
Recorded: 2010-04-07
Pages: 5
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Stacked Chips Package Having Feed-Through Electrode Connecting the First and Second Semiconductor Components via an Adhesive Layer.