IP Library › Assignment 024199/0631
Patent Assignment
Reel/Frame 024199/0631

Assignment of Assignor's Interest

Recorded: 2010-04-07 Pages: 3
Assignor
OSHIMA ELECTRONIC WORKS CO., LTD.
Executed: 2010-03-29
Assignee
MITSUBA CORPORATION
2681 HIROSAWACHO 1-CHOME, KIRYU-SHI, GUNMA 376-8555, JAPAN
Covered Properties (3)
Method of Forming Film on Molded Body, Method of Producing Molded Body with Film Formed Thereon, Mold for Producing Molded Body with Film Formed Thereon
Patent: 7,744,798 →
Application: 10/557,475 →
Publication: US 2007/0018351
Film Forming Mold, Film Forming Method Using Mold, and Film Forming Control System
Patent: 7,740,783 →
Application: 10/557,784 →
Publication: US 2007/0029700
Film-Provided Molded Piece, Method for and Apparatus for Producing the Same
Patent: 7,855,494 →
Application: 11/885,445 →
Publication: US 2009/0243460
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 18, 2005
From: ISHIZAWA, MOTOSUKE; UMEZAWA, TAKAO
To: OSHIMA ELECTRIC WORKS CO., LTD.
Reel/Frame 017954/0557 →
Assignment of Assignor's Interest Nov 18, 2005
From: ISHIZAWA, MOTOSUKE; UMEZAWA, TAKAO
To: OSHIMA ELECTRIC WORKS CO., LTD.
Reel/Frame 017973/0830 →
Assignment of Assignor's Interest Aug 31, 2007
From: UMEZAWA, TAKAO
To: OSHIMA ELECTRIC WORKS CO., LTD.
Reel/Frame 019826/0072 →