Patent Assignment
Reel/Frame 024201/0962
Assignment of Assignor's Interest
Recorded: 2010-04-08
Pages: 2
Assignors
SASAKI, YOSHITAKA
Executed: 2010-03-29
ITO, HIROYUKI
Executed: 2010-03-29
IIJIMA, ATSUSHI
Executed: 2010-03-31
Assignees
HEADWAY TECHNOLOGIES, INC.
678 S. HILLVIEW DR., MILPITAS, CALIFORNIA, 95035
SAE MAGNETICS (H.K.) LTD.
SAE TECHNOLLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T., HONG KONG, CHINA
Covered Property
(1)
Method of Manufacturing Layered Chip Package