Patent Assignment
Reel/Frame 024204/0784
Assignment of Assignor's Interest
Recorded: 2010-04-08
Pages: 4
Assignors
HAYAKAWA, AKINOBU
Executed: 2010-03-30
ISHIZAWA, HIDEAKI
Executed: 2010-03-30
TAKEDA, KOHEI
Executed: 2010-03-30
MASUI, RYOHEI
Executed: 2010-03-30
Assignee
SEKISUI CHEMICAL CO., LTD.
4-4, NISHITEMMA 2-CHOME, KITA-KU, OSAKA-SHI,, OSAKA, 530-8565, JAPAN
Covered Property
(1)
Adhesive for Electronic Component