Patent Assignment
Reel/Frame 024209/0909
Assignment of Assignor's Interest
Recorded: 2010-04-09
Pages: 2
Assignors
HUANG, YU-LIEN
Executed: 2010-03-25
CHUNG, HAN-PIN
Executed: 2010-03-25
WANG, SHIANG-BAU
Executed: 2010-03-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Sti Structure and Method of Forming Bottom Void in Same