Patent Assignment
Reel/Frame 024211/0446
Assignment of Assignor's Interest
Recorded: 2010-04-09
Pages: 4
Assignors
WEI, HSIU-PING
Executed: 2010-03-26
JENG, SHIN-PUU
Executed: 2010-03-30
TSAI, HAO-YI
Executed: 2010-03-26
CHEN, HSIEN-WEI
Executed: 2010-03-26
LIU, YU-WEN
Executed: 2010-03-26
CHEN, YING-JU
Executed: 2010-03-26
LIU, TZUAN-HORNG
Executed: 2010-03-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Package Structure and Method for Reducing Dielectric Layer Delamination