Patent Assignment
Reel/Frame 024219/0153
Assignment of Assignor's Interest
Recorded: 2010-04-12
Pages: 5
Assignors
LI, XIA
Executed: 2009-08-31
ZHAO, WEI
Executed: 2009-08-31
BANG, DAVID
Executed: 2009-08-31
CAO, YU
Executed: 2009-08-31
KANG, SEUNG H.
Executed: 2009-08-31
NOWAK, MATTHEW
Executed: 2009-08-31
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, PATENT DEPARTMENT, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Predictive Modeling of Contact and via Modules for Advanced on-Chip Interconnect Technology