Patent Assignment
Reel/Frame 024222/0659
Assignment of Assignor's Interest
Recorded: 2010-04-13
Pages: 7
Assignors
PARVARANDEH, PIROOZ
Executed: 2010-04-06
ALVARADO, REYNANTE
Executed: 2010-03-31
LO, CHIUNG C.
Executed: 2010-03-31
SAMOILOV, ARKADII V.
Executed: 2010-03-31
Assignee
MAXIM INTEGRATED PRODUCTS, INC.
120 SAN GABRIEL DRIVE, SUNNYVALE, CALIFORNIA, 94086
Covered Property
(1)
Wafer-Level Chip-Scale Package Device Having Bump Assemblies Configured to Mitigate Failures Due to Stress