Patent Assignment
Reel/Frame 024226/0316
Assignment of Assignor's Interest
Recorded: 2010-04-13
Pages: 2
Assignor
KAJIYAMA, KEIICHI
Executed: 2010-03-23
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Optical Device Wafer Processing Method