Patent Assignment
Reel/Frame 024227/0796
Assignment of Assignor's Interest
Recorded: 2010-04-14
Pages: 5
Assignors
ISSHIKI, MINORU
Executed: 2008-08-08
KATO, TOMOKO
Executed: 2008-08-08
MORITA, YOSHITSUGU
Executed: 2008-08-08
UEKI, HIROSHI
Executed: 2008-08-08
Assignee
DOW CORNING TORAY COMPANY, LTD.
1-3, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-0005, JAPAN
Covered Property
(1)
Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby