IP Library Assignment 024229/0145
Patent Assignment
Reel/Frame 024229/0145

Assignment of Assignor's Interest

Recorded: 2010-04-14 Pages: 2
Assignors
TANDOU, TAKUMI
Executed: 2010-01-25
IZAWA, MASARU
Executed: 2010-02-04
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHI SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Vacuum Processing Apparatus and Plasma Processing Apparatus with Temperature Control Function for Wafer Stage
Patent: 8,349,127 →
Application: 12/696,552 →
Publication: US 2011/0132541
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name and Address Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →