Patent Assignment
Reel/Frame 024232/0233
Assignment of Assignor's Interest
Recorded: 2010-04-14
Pages: 4
Assignors
WANG, WEN-DE
Executed: 2010-02-23
YAUNG, DUN-NIAN
Executed: 2010-02-23
LIU, JEN-CHENG
Executed: 2010-02-23
CHUANG, CHUN-CHIEH
Executed: 2010-02-23
LIN, JENG-SHYAN
Executed: 2010-02-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Pad Design for Backside Illuminated Image Sensor