Patent Assignment
Reel/Frame 024245/0934
Assignment of Assignor's Interest
Recorded: 2010-04-16
Pages: 4
Assignors
EOM, YONG SUNG
Executed: 2009-12-02
MOON, JONG TAE
Executed: 2009-12-02
CHOI, KWANG-SEONG
Executed: 2009-12-02
Assignee
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
161 GAJEONG-DONG, YUSEONG-GU, DAEJEON, 305-700, KOREA, REPUBLIC OF
Covered Property
(1)
Method and Structure for Bonding Flip Chip