IP Library Assignment 024249/0962
Patent Assignment
Reel/Frame 024249/0962

Assignment of Assignor's Interest

Recorded: 2010-04-19 Pages: 3
Assignors
TSAI, PO-HAO
Executed: 2010-04-14
LIN, JING-CHENG
Executed: 2010-04-14
YU, CHEN-HUA
Executed: 2010-04-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Tsvs with Different Sizes in Interposers for Bonding Dies
Patent: 8,455,995 →
Application: 12/762,085 →
Publication: US 2011/0254160