Patent Assignment
Reel/Frame 024302/0056
Assignment of Assignor's Interest
Recorded: 2010-04-28
Pages: 2
Assignors
CHIU, CHI-HSIN
Executed: 2010-04-01
HUANG, CHIH-MING
Executed: 2010-04-01
CHAN, CHANG-YUEH
Executed: 2010-04-01
LIAO, HSIN-YI
Executed: 2010-04-01
KE, CHUN-CHI
Executed: 2010-04-01
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Fabrication Method of Package Structure Having Mems Element