Patent Assignment
Reel/Frame 024324/0584
Assignment of Assignor's Interest
Recorded: 2010-05-03
Pages: 2
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, JAPAN
Covered Property
(1)
Adhesive Sheet for Semiconductor, and Dicing Tape Integrated Adhesive Sheet for Semiconductor
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Jan 25, 2018
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 045142/0097 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →