Patent Assignment
Reel/Frame 024324/0586
Assignment of Assignor's Interest
Recorded: 2010-05-03
Pages: 2
Assignor
IHARA, YOSHIHIRO
Executed: 2010-03-15
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Semiconductor Device, Electronic Device and Method of Manufacturing Semiconductor Device, Having Electronic Component, Sealing Resin and Multilayer Wiring Structure