IP Library › Assignment 024336/0854
Patent Assignment
Reel/Frame 024336/0854

Assignment of Assignor's Interest

Recorded: 2010-05-05 Pages: 7
Assignors
DURAISWAMY, SRINIVASAN
Executed: 2010-05-04
Assignee
LAIRD TECHNOLOGIES, INC.
16401 SWINGLEY RIDGE ROAD, CHESTERFIELD, MISSOURI, 63017
Covered Property (1)
Highly Thermally-Conductive Moldable Thermoplastic Composites and Compositions
Patent: 8,299,159 →
Application: 12/773,422 →
Publication: US 2011/0040007
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →