Patent Assignment
Reel/Frame 024340/0010
Assignment of Assignor's Interest
Recorded: 2010-05-05
Pages: 2
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Solder Bump, Semiconductor Chip, Method of Manufacturing the Semiconductor Chip, Conductive Connection Structure, and Method of Manufacturing the Conductive Connection Structure