Assignment of Assignor's Interest

Recorded: 2010-05-06 Pages: 8

Assignors

GEORGE, GREGORY

Executed: 2010-04-26

JOHNSON, HALE

Executed: 2010-04-26

GORUN, PATRICK

Executed: 2010-04-26

HERMANOWSKI, JAMES

Executed: 2010-04-30

STILES, MATTHEW

Executed: 2010-04-26

Assignee

SUSS MICROTEC INC

228 SUSS DRIVE, WATERBURY CENTER, VERMONT, 05677

Covered Property (1)

Apparatus for Mechanically Debonding Temporary Bonded Semiconductor Wafers

Patent: 8,267,143 →

Application: 12/761,014 →

Publication: US 2010/0263794

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.