IP Library › Assignment 025952/0868
Patent Assignment
Reel/Frame 025952/0868

Assignment of Assignor's Interest

Recorded: 2011-03-15 Pages: 8
Assignor
SUSS MICROTEC INC
Executed: 2011-03-10
Assignee
SUSS MICROTEC LITHOGRAPHY, GMBH
90 SCHLEISSHEIMER STR, GARCHING, 85748, GERMANY
Covered Properties (24)
Apparatus and Method for Semiconductor Bonding
Apparatus and Method for in-Situ Monitoring of Wafer Bonding Time
Apparatus and Method for Semiconductor Wafer Alignment
Improved Method and Apparatus for Wafer Bonding
Method and Apparatus for Wafer Bonding with Enhanced Wafer Mating
Rapid Fabrication of a Microelectronic Temporary Support for Inorganic Substrates
Improved Apparatus for Temporary Wafer Bonding and Debonding
Automated Thermal Slide Debonder
Thin Wafer Carrier
Proximity Mask Alignment Using a Stored Video Image
Patent: 5,204,739 →
Application: 07/832,413 →
Apparatus and Method for Semiconductor Bonding
Patent: 7,948,034 →
Application: 11/766,531 →
Publication: US 2007/0296035
Apparatus and Method for in-Situ Monitoring of Wafer Bonding Time
Patent: 7,612,895 →
Application: 12/118,100 →
Publication: US 2008/0285059
Apparatus and Method for Semiconductor Wafer Alignment
Patent: 8,139,219 →
Application: 12/416,779 →
Publication: US 2009/0251699
Method and Apparatus for Wafer Bonding
Application: 12/481,692 →
Publication: US 2010/0089978
Method and Apparatus for Wafer Bonding with Enhanced Wafer Mating
Patent: 8,147,630 →
Application: 12/618,846 →
Publication: US 2010/0122762
Rapid Fabrication of a Microelectronic Temporary Support for Inorganic Substrates
Application: 12/725,351 →
Publication: US 2010/0264566
Apparatus for Temporary Wafer Bonding and Debonding
Patent: 8,181,688 →
Application: 12/760,640 →
Publication: US 2011/0014774
Apparatus for Thermal-Slide Debonding of Temporary Bonded Semiconductor Wafers
Patent: 8,919,412 →
Application: 12/760,973 →
Publication: US 2011/0010908
Apparatus for Mechanically Debonding Temporary Bonded Semiconductor Wafers
Patent: 8,267,143 →
Application: 12/761,014 →
Publication: US 2010/0263794
Device for Centering Wafers
Patent: 8,764,026 →
Application: 12/761,044 →
Publication: US 2010/0266373
Automated Thermal Slide Debonder
Patent: 8,343,300 →
Application: 12/975,521 →
Publication: US 2011/0146901
Thin Wafer Carrier
Patent: 9,159,595 →
Application: 13/022,215 →
Publication: US 2011/0198817
Debonding Equipment and Methods for Debonding Temporary Bonded Wafers
Application: 61/324,888 →
Apparatus and Method for Detaping an Adhesive Layer from the Surface of Ultra Thin Wafers
Application: 61/348,794 →
Related Assignments (17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Feb 7, 1992
From: DOMENICALI, PETER L.
To: KARL SUSS AMERICA, INC.
Reel/Frame 006010/0188 →
Security Interest Jul 6, 1999
From: KARL SUSS AMERICA, INC.
To: HOWARD BANK, N.A., THE
Reel/Frame 010070/0397 →
Assignment of Assignor's Interest Jun 22, 2007
From: GEORGE, GREGORY; HANCOCK, ETIENNE; CAMPBELL, ROBERT
To: SUSS MICROTEC, INC
Reel/Frame 019470/0001 →
Assignment of Assignor's Interest May 6, 2010
From: GEORGE, GREGORY
To: SUSS MICROTEC INC
Reel/Frame 024345/0604 →
Assignment of Assignor's Interest May 6, 2010
From: GEORGE, GREGORY; JOHNSON, HALE; GORUN, PATRICK; HERMANOWSKI, JAMES
To: SUSS MICROTEC INC
Reel/Frame 024345/0348 →
Assignment of Assignor's Interest May 6, 2010
From: GEORGE, GREGORY; JOHNSON, HALE; PATRICIO, DENNIS
To: SUSS MICROTEC INC
Reel/Frame 024345/0495 →
Assignment of Assignor's Interest Oct 5, 2010
From: GEORGE, GREGORY
To: SUSS MICROTEC INC
Reel/Frame 025090/0668 →
Assignment of Assignor's Interest Oct 5, 2010
From: GEORGE, GREGORY
To: SUSS MICROTEC INC
Reel/Frame 025090/0635 →
Assignment of Assignor's Interest Oct 5, 2010
From: JOHNSON, HALE; GORUN, PATRICK; HUGHLETT, EMMETT; HERMANOWSKI, JAMES
To: SUSS MICROTEC INC
Reel/Frame 025091/0005 →
Assignment of Assignor's Interest Oct 5, 2010
From: GEORGE, GREGORY; JOHNSON, HALE; GORUN, PATRICK; HUGHLETT, EMMETT
To: SUSS MICROTEC INC
Reel/Frame 025091/0081 →
Assignment of Assignor's Interest Dec 21, 2010
From: HUGHLETT, EMMETT
To: SUSS MICROTEC INC
Reel/Frame 025548/0223 →
Assignment of Assignor's Interest Jan 10, 2011
From: JOHNSON, HALE
To: SUSS MICROTEC INC
Reel/Frame 025605/0159 →
Assignment of Assignor's Interest Feb 24, 2011
From: PRICE, THOMAS
To: SUSS MICROTEC INC
Reel/Frame 025859/0707 →
Change of Name Mar 7, 2011
From: KARL SUSS AMERICA, INC
To: SUSS MICROTEC INC
Reel/Frame 025912/0016 →
Assignment of Assignor's Interest Aug 13, 2015
From: HURLEY, DANIEL T.
To: SUSS MICROTEC, INC.
Reel/Frame 036322/0104 →
Assignment of Assignor's Interest Aug 20, 2015
From: GEORGE, GREGORY
To: SUSS MICROTEC, INC.
Reel/Frame 036386/0856 →
Assignment of Assignor's Interest Oct 2, 2015
From: SUSS MICROTEC, INC.
To: SUSS MICROTEC LITHOGRAPHY GMBH
Reel/Frame 036719/0470 →