Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

1. A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers, comprising:

a top chuck assembly comprising a heater and a wafer holder;

a bottom chuck assembly;

a static gantry supporting the top chuck assembly;

an X-axis carriage drive supporting the bottom chuck assembly;

an X-axis drive control configured to drive horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone;

wherein a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is configured to be placed upon said bottom chuck assembly at the loading zone oriented so that an unbonded surface of the device wafer is in contact with the bottom assembly and is configured to be carried by said X-axis carriage drive to the process zone under the top chuck assembly and an unbonded surface of the carrier wafer is placed in contact with the top chuck assembly; and

wherein said X-axis drive control is configured to initiate horizontal motion of said X-axis carriage drive along the X-axis while said bonded wafer pair is heated via said heater to a temperature around or above said adhesive layer's melting point and while said carrier wafer is held by said top chuck assembly via said wafer holder and said device wafer is held by said bottom assembly and thereby causes the device wafer to separate and slide away from the carrier wafer; and

wherein said bottom chuck assembly comprises a bottom chuck comprising a ceramic material and is designed to slide horizontally along the X-axis upon said X-axis carriage drive and to twist around the Z-axis.

2. The debonder of claim 1 further comprising a lift pin assembly designed to raise and lower wafers placed on the bottom chuck assembly.

3. The debonder of claim 1 further comprising a base plate supporting the X-axis carriage drive and the static gantry.

4. The debonder of claim 3 wherein said base plate comprises a honeycomb structure and vibration isolation supports.

5. The debonder of claim 3 wherein said base plate comprises a granite plate.

6. The debonder of claim 1 wherein said X-axis carriage drive comprises an air bearing carriage drive.

7. The debonder of claim 1 further comprising two parallel lateral carriage guidance tracks guiding said X-axis carriage drive in its horizontal motion along the X-axis.

8. The debonder of claim 1 ,wherein said top chuck assembly further comprises:

a top support chuck bolted to the static gantry;

a heater support plate in contact with the bottom surface of the top support chuck;

said heater being in contact with the bottom surface of the heater support plate;

a top plate in contact with the heater;

a Z-axis drive for moving the top plate in the Z-direction and placing the top plate in contact with the unbonded surface of the carrier wafer; and

a plate leveling system for leveling the top plate.

9. The debonder of claim 8 , wherein said wafer holder is configured to pull said carrier wafer via vacuum.

10. The debonder of claim 8 , wherein said plate leveling system comprises three guide shafts and three pneumatically actuated split clamps, and wherein said three guide shafts connect said heater to said top support chuck.

11. The debonder of claim 8 , wherein said heater comprises two independently controlled concentric heating zones having a diameter of 200 and 300 millimeters, respectively.

12. A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers, comprising:

a top chuck assembly comprising a heater and a wafer holder;

a bottom chuck assembly;

a static gantry supporting the top chuck assembly;

an X-axis carriage drive supporting the bottom chuck assembly;

an X-axis drive control configured to drive horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone;

wherein a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is configured to be placed upon said bottom chuck assembly at the loading zone oriented so that an unbonded surface of the device wafer is in contact with the bottom assembly and is configured to be carried by said X-axis carriage drive to the process zone under the top chuck assembly and an unbonded surface of the carrier wafer is placed in contact with the top chuck assembly;

wherein said X-axis drive control is configured to initiate horizontal motion of said X-axis carriage drive along the X-axis while said bonded wafer pair is heated via said heater to a temperature around or above said adhesive layer's melting point and while said carrier wafer is held by said top chuck assembly via said wafer holder and said device wafer is held by said bottom assembly and thereby causes the device wafer to separate and slide away from the carrier wafer; and

a base plate supporting the X-axis carriage drive and the static gantry; and

wherein said base plate comprises a honeycomb structure and vibration isolation supports.

13. The debonder of claim 12 , wherein said bottom chuck assembly comprises a bottom chuck comprising a ceramic material and is designed to slide horizontally along the X-axis upon said X-axis carriage drive and to twist around the Z-axis.

14. A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers, comprising:

a top chuck assembly comprising a heater and a wafer holder;

a bottom chuck assembly;

a static gantry supporting the top chuck assembly;

an X-axis carriage drive supporting the bottom chuck assembly;

an X-axis drive control configured to drive horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone;

wherein a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is configured to be placed upon said bottom chuck assembly at the loading zone oriented so that an unbonded surface of the device wafer is in contact with the bottom assembly and is configured to be carried by said X-axis carriage drive to the process zone under the top chuck assembly and an unbonded surface of the carrier wafer is placed in contact with the top chuck assembly;

wherein said X-axis drive control is configured to initiate horizontal motion of said X-axis carriage drive along the X-axis while said bonded wafer pair is heated via said heater to a temperature around or above said adhesive layer's melting point and while said carrier wafer is held by said top chuck assembly via said wafer holder and said device wafer is held by said bottom assembly and thereby causes the device wafer to separate and slide away from the carrier wafer; and

a base plate supporting the X-axis carriage drive and the static gantry; and

wherein said base plate comprises a granite plate.

15. The debonder of claim 14 , wherein said bottom chuck assembly comprises a bottom chuck comprising a ceramic material and is designed to slide horizontally along the X-axis upon said X-axis carriage drive and to twist around the Z-axis.