IP Library Assignment 025091/0081
Patent Assignment
Reel/Frame 025091/0081

Assignment of Assignor's Interest

Recorded: 2010-10-05 Pages: 9
Assignors
GEORGE, GREGORY
Executed: 2010-04-26
JOHNSON, HALE
Executed: 2010-04-26
GORUN, PATRICK
Executed: 2010-04-26
HUGHLETT, EMMETT
Executed: 2010-10-04
HERMANOWSKI, JAMES
Executed: 2010-04-30
STILES, MATTHEW
Executed: 2010-04-26
Assignee
SUSS MICROTEC INC
228 SUSS DRIVE, WATERBURY CENTER, VERMONT, 05677
Covered Property (1)
Apparatus for Thermal-Slide Debonding of Temporary Bonded Semiconductor Wafers
Patent: 8,919,412 →
Application: 12/760,973 →
Publication: US 2011/0010908
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 15, 2011
From: SUSS MICROTEC INC
To: SUSS MICROTEC LITHOGRAPHY, GMBH
Reel/Frame 025952/0868 →