Patent Assignment
Reel/Frame 025091/0005
Assignment of Assignor's Interest
Recorded: 2010-10-05
Pages: 9
Assignors
JOHNSON, HALE
Executed: 2010-04-26
GORUN, PATRICK
Executed: 2010-04-26
HUGHLETT, EMMETT
Executed: 2010-10-04
HERMANOWSKI, JAMES
Executed: 2010-04-30
STILES, MATTHEW
Executed: 2010-04-26
KUHNLE, MICHAEL
Executed: 2010-04-26
Assignee
SUSS MICROTEC INC
228 SUSS DRIVE, WATERBURY CENTER, VERMONT, 05677
Covered Property
(1)
Apparatus for Temporary Wafer Bonding and Debonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.