Patent Assignment
Reel/Frame 025605/0159
Assignment of Assignor's Interest
Recorded: 2011-01-10
Pages: 6
Assignor
JOHNSON, HALE
Executed: 2010-12-21
Assignee
SUSS MICROTEC INC
228 SUSS DRIVE, WATERBURY CENTER, VERMONT, 05677
Covered Property
(1)
Method and Apparatus for Wafer Bonding
Application:
12/481,692 →
Publication:
US 2010/0089978
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 21, 2010
From: HUGHLETT, EMMETT
To: SUSS MICROTEC INC
Reel/Frame 025548/0223 →
Assignment of Assignor's Interest
Feb 24, 2011
From: PRICE, THOMAS
To: SUSS MICROTEC INC
Reel/Frame 025859/0707 →
Assignment of Assignor's Interest
Mar 15, 2011
From: SUSS MICROTEC INC
To: SUSS MICROTEC LITHOGRAPHY, GMBH
Reel/Frame 025952/0868 →