Assignment of Assignor's Interest

Recorded: 2010-10-05 Pages: 3

Assignor

GEORGE, GREGORY

Executed: 2010-10-04

Assignee

SUSS MICROTEC INC

228 SUSS DRIVE, WATERBURY CENTER, VERMONT, 05677

Covered Property (1)

Method and Apparatus for Wafer Bonding with Enhanced Wafer Mating

Patent: 8,147,630 →

Application: 12/618,846 →

Publication: US 2010/0122762

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.