Patent Assignment
Reel/Frame 024365/0888
Assignment of Assignor's Interest
Recorded: 2010-05-11
Pages: 6
Assignors
KIM, DAE-IK
Executed: 2010-05-07
PARK, JE-MIN
Executed: 2010-04-16
HYUN, CHANG-SUK
Executed: 2010-04-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Integrated Circuit Devices Including Air Spacers Separating Conductive Structures and Contact Plugs