Patent Assignment
Reel/Frame 024371/0161
Assignment of Assignor's Interest
Recorded: 2010-05-06
Pages: 3
Assignee
SHARP KABUSHIKI KAISHA
22-22 NAGAIKE-CHO, ABENO-KU, OSAKA-SHI, OSAKA, 545-8522, JAPAN
Covered Property
(1)
Semiconductor Apparatus Packaging Structure Having Embossed Tape Over Tab Tape, the Embossed Tape and Method of Forming the Semiconductor Apparatus Packaging Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.