Assignment of Assignor's Interest

Recorded: 2020-02-05 Pages: 5

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Assignor

SHARP KABUSHIKI KAISHA

Executed: 2019-08-29

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN

Covered Properties (5)

A Connection Terminal and a Semiconductor Device Including at Least One Connection Terminal

Patent: 6,908,311 →

Application: 10/422,749 →

Publication: US 2003/0203661

Photodetection Sensor

Patent: 6,855,886 →

Application: 10/766,909 →

Publication: US 2004/0182591

Ic Chip Package and Image Display Device Incorporating Same

Patent: 8,080,823 →

Application: 12/312,982 →

Publication: US 2010/0025681

Semiconductor Apparatus Packaging Structure Having Embossed Tape Over Tab Tape, the Embossed Tape and Method of Forming the Semiconductor Apparatus Packaging Structure

Patent: 8,390,104 →

Application: 12/734,510 →

Publication: US 2010/0230793

Semiconductor device and method for manufacturing the same

Patent: 8,466,026 →

Application: 12/805,621 →

Publication: US 2011/0042756

Related Assignments (5)

Other recorded transfers of the patents in this record — the chain of ownership.

Assignment of Assignor's Interest Apr 25, 2003

From: ONO, ATSUSHI; ASAZU, TAKURO; YAMAGUCHI, SHINJI

To: SHARP KABUSHIKI KAISHA

Reel/Frame 014016/0486 →

Assignment of Assignor's Interest Jan 30, 2004

From: KAWAMURA, MASAHIRO; SHINDO, HIROFUMI

To: SHARP KABUSHIKI KAISHA

Reel/Frame 014948/0200 →

Assignment of Assignor's Interest Sep 29, 2009

From: KATOH, TATSUYA; KUDOSE, SATORU; NAKAGAWA, TOMOKATSU

To: SHARP KABUSHIKI KAISHA

Reel/Frame 023326/0861 →

Assignment of Assignor's Interest May 6, 2010

From: KUDOSE, SATORU; TOYOSAWA, KENJI

To: SHARP KABUSHIKI KAISHA

Reel/Frame 024371/0161 →

Assignment of Assignor's Interest Aug 10, 2010

From: HIKIDA, SATOSHI

To: SHARP KABUSHIKI KAISHA

Reel/Frame 024843/0006 →