Photodetection sensor
A photodetection sensor allows electrical connection between conductive resin and grounding terminal to be reliably fulfilled, and is capable of obtaining a larger electromagnetic shield effect so that the photodetection sensor can be used even under electromagnetic noise-prone environments. Also, a photodetection sensor no longer necessitates a separate component metal mesh so that the photodetection sensor is low in price, simple to manufacture and high in productivity. Through holes are formed in electrical connecting portions connected to a grounding terminal via a header. The electrical connecting portions are protruded from a surface of a light-pervious resin and encapsulated in an electrically conductive resin. This conductive resin is filled into the through holes and engaged with inner surfaces of the through holes like an anchor, thus unlikely to peel off. Therefore, the grounding of the electrically conductive resin is ensured, allowing a stable electromagnetic shield effect to be obtained.
1. A photodetection sensor comprising:
a lead frame having a grounding terminal, a header connected to this grounding terminal, and signal input/output terminals;
a photodetection chip mounted on a surface of the header of the lead frame;
an insulative light-pervious resin encapsulating the photodetection chip and part of the lead frame, tip end portions of the signal input/output terminals of the lead frame being protruded from the light-pervious resin; and
an electrically conductive resin encapsulating a surface of the light-pervious resin except at least a terminal-side exposed portion of the light-pervious resin in vicinity of the tip end portions of the signal input/output terminals, and wherein
the lead frame includes:
an electrical connecting portion directly or indirectly connected to the grounding terminal of the lead frame and having a through hole, and wherein
the electrical connecting portion is protruded from the light-pervious resin and encapsulated in the electrically conductive resin.
2. The photodetection sensor according to claim 1 , wherein a diameter of the through hole is not less than a plate thickness of the lead frame.
3. The photodetection sensor according to claim 1 , wherein
the terminal-side exposed portion of the light-pervious resin has a length of at least 0.2 mm in a direction along which the signal input/output terminals extend.
4. The photodetection sensor according to claim 1 , wherein
the electrically conductive resin has a resistivity of not more than 100 Ω·cm.
5. The photodetection sensor according to claim 1 , wherein
the light-pervious resin has a lens portion confronting the photodetection chip, and wherein
a rear-face-side exposed portion that is not covered with the electrically conductive resin but exposed is present at a portion of the light-pervious resin that covers a rear face of the header on one side opposite to a surface side on which the photodetection chip is mounted, and this rear-face-side exposed portion confronts the rear face of the header and a projection plan of the rear-face-side exposed portion onto the rear face of the header falls inside a profile of the rear face of the header.
6. The photodetection sensor according to claim 1 , wherein
the light-pervious resin has a lens portion confronting the photodetection chip, and
the photodetection sensor further includes a meshed electrically conductive resin that covers part of a surface of the lens portion.
7. A photodetection sensor comprising:
a lead frame having a grounding terminal, a header connected to this grounding terminal, and signal input/output terminals;
a photodetection chip mounted on a surface of the header of the lead frame;
an insulative light-pervious resin encapsulating the photodetection chip and part of the lead frame, tip end portions of the signal input/output terminals of the lead frame being protruded from the light-pervious resin; and
an electrically conductive resin encapsulating a surface of the light-pervious resin except at least a terminal-side exposed portion of the light-pervious resin in vicinity of the tip end portions of the signal input/output terminals, and wherein
the terminal-side exposed portion of the light-pervious resin has a length of at least 0.2 mm in a direction along which the signal input/output terminals extend.
8. A photodetection sensor comprising:
a lead frame having a grounding terminal, a header connected to this grounding terminal, and signal input/output terminals;
a photodetection chip mounted on a surface of the header of the lead frame;
an insulative light-pervious resin encapsulating the photodetection chip and part of the lead frame, tip end portions of the signal input/output terminals of the lead frame being protruded from the light-pervious resin; and
an electrically conductive resin encapsulating a surface of the light-pervious resin except at least a terminal-side exposed portion of the light-pervious resin in vicinity of the tip end portions of the signal input/output terminals, and wherein
the lead frame includes:
an electrical connecting portion directly or indirectly connected to the grounding terminal,
the electrical connecting portion is protruded from the light-pervious resin and encapsulated in the electrically conductive resin, and wherein
the electrically conductive resin has a resistivity of not more than 100 Ω·cm.
9. A photodetection sensor comprising:
a lead frame having a grounding terminal, a header connected to this grounding terminal, and signal input/output terminals;
a photodetection chip mounted on a surface of the header of the lead frame;
an insulative light-pervious resin encapsulating the photodetection chip and part of the lead frame, tip end portions of the signal input/output terminals of the lead frame being protruded from the light-pervious resin; and
an electrically conductive resin encapsulating a surface of the light-pervious resin except at least a terminal-side exposed portion of the light-pervious resin in vicinity of the tip end portions of the signal input/output terminals, and wherein
the light-pervious resin has a lens portion confronting the photodetection chip, and wherein
a rear-face-side exposed portion that is not covered with the electrically conductive resin but exposed is present at a portion of the light-pervious resin that covers a rear face of the header on one side opposite to a surface side on which the photodetection chip is mounted, and this rear-face-side exposed portion confronts the rear face of the header and a projection plan of the rear-face-side exposed portion onto the rear face of the header falls inside a profile of the rear face of the header.
10. A method for manufacturing a photodetection sensor, comprising the steps of:
mounting a photodetection chip onto a surface of a header of a lead frame connected to a grounding terminal of the lead frame, and encapsulating the photodetection chip and part of the lead frame in an insulative light-pervious resin having a lens portion confronting the photodetection chip, by which a light-pervious resin package is formed; and
setting the light-pervious resin package into a metal mold for use with electrically conductive resin, and pressing in one direction, by means of a fixed pin, a surface of the light-pervious resin of the light-pervious resin package confronting a rear face of the header and corresponding to inside of a profile of the rear face of the header, by which at least part of the lens portion is put into close contact with an inner surface of the metal mold, and injecting an electrically conductive resin into the metal mold, by which the light-pervious resin package except at least part of the lens portion is encapsulated in the electrically conductive resin.
11. A photodetection sensor comprising:
a lead frame having a grounding terminal, a header connected to this grounding terminal, and signal input/output terminals;
a photodetection chip mounted on a surface of the header of the lead frame;
an insulative light-pervious resin encapsulating the photodetection chip and part of the lead frame, tip end portions of the signal input/output terminals of the lead frame being protruded from the light-pervious resin; and
an electrically conductive resin encapsulating a surface of the light-pervious resin except at least a terminal-side exposed portion of the light-pervious resin in vicinity of the tip end portions of the signal input/output terminals, and wherein
the light-pervious resin has a lens portion confronting the photodetection chip, and wherein
the photodetection sensor further includes a meshed electrically conductive resin that covers part of a surface of the lens portion.