Assignment of Assignor's Interest

Recorded: 2010-05-12 Pages: 5

Assignors

LIU, WEIPING

Executed: 2010-04-15

LEE, NING-CHENG, DR.

Executed: 2010-05-10

Assignee

INDIUM CORPORATION

34 ROBINSON ROAD, CLINTON, NEW YORK, 13323

Covered Property (1)

Composite Solder Alloy Preform

Patent: 8,348,139 →

Application: 12/720,532 →

Publication: US 2011/0220704