Patent Assignment
Reel/Frame 024375/0108
Assignment of Assignor's Interest
Recorded: 2010-05-12
Pages: 3
Assignors
NOMURA, YUTAKA
Executed: 2010-04-26
NAKAGAWA, HIROSHI
Executed: 2010-04-26
ANZAI, SOU
Executed: 2010-04-26
TOBITA, AYAKO
Executed: 2010-04-26
SAKURADA, TAKAFUMI
Executed: 2010-04-26
MABUCHI, KATSUMI
Executed: 2010-04-26
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Metal Polishing Slurry and Method of Polishing a Film to be Polished
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
May 6, 2014
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 032827/0222 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →