Patent Assignment
Reel/Frame 024378/0587
Assignment of Assignor's Interest
Recorded: 2010-05-13
Pages: 2
Assignor
REACTIVE NANOTECHNOLOGIES, INC.
Executed: 2010-05-06
Assignee
NANOFOIL CORPORATION
111 BUSINESS PARK DRIVE, UTICA, NEW YORK, 13502
Covered Property
(1)
Method for Low Temperature Bonding of Electronic Components
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 6, 2010
From: VAN HEERDEN, DAVID, MR.; VINCENT, RAMZI, MR.; RUDE, TIMOTHY RYAN, MR.
To: REACTIVE NANOTECHNOLOGIES, INC.
Reel/Frame 024346/0616 →
Assignment of Assignor's Interest
May 13, 2024
From: THE INDIUM CORPORATION OF AMERICA
To: THERMAL CONDUCTIVE BONDING, INC.
Reel/Frame 067387/0848 →